GENEVA, Sept. 18 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/042707) for “DISTRIBUTED DYNAMIC POWER MANAGEMENT WITHOUT REAL TIME MANAGER”. With publication no. WO/2026/1873... और पढ़ें
GENEVA, Sept. 18 -- WARDEN, Brian filed a patent application (US2025/037731) for “WEARABLE EYE IRRIGATION SYSTEM”. With publication no. WO/2026/187379, here are the other details related to the patent... और पढ़ें
GENEVA, Sept. 18 -- CELLARES CORPORATION filed a patent application (US2025/038972) for “INTEGRATED, MULTI-INSTRUMENT SYSTEM FOR AUTOMATED BIOPROCESSING”. With publication no. WO/2026/187380, here are... और पढ़ें
GENEVA, Sept. 18 -- CELLARES CORPORATION filed a patent application (US2025/038972) for “INTEGRATED, MULTI-INSTRUMENT SYSTEM FOR AUTOMATED BIOPROCESSING”. With publication no. WO/2026/187380, here are... और पढ़ें
GENEVA, Sept. 18 -- SNELL, John, Thomas filed a patent application (US2025/040354) for “ODD/EVEN SENSOR BOXING”. With publication no. WO/2026/187382, here are the other details related to the patent a... और पढ़ें
GENEVA, Sept. 18 -- SNELL, John, Thomas filed a patent application (US2025/040354) for “ODD/EVEN SENSOR BOXING”. With publication no. WO/2026/187382, here are the other details related to the patent a... और पढ़ें
GENEVA, Sept. 18 -- HALLIBURTON ENERGY SERVICES, INC. filed a patent application (US2025/040392) for “COLLAPSABLE COLLET EXIT WHIPSTOCK”. With publication no. WO/2026/187383, here are the other detail... और पढ़ें
GENEVA, Sept. 18 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/035198) for “THREE-DIMENSIONAL MEMORY DEVICE WITH SPLIT DIELECTRIC WALL STRUCTURES AND METHODS FOR FORMING THE SAME”. ... और पढ़ें
GENEVA, Sept. 18 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/035198) for “THREE-DIMENSIONAL MEMORY DEVICE WITH SPLIT DIELECTRIC WALL STRUCTURES AND METHODS FOR FORMING THE SAME”. ... और पढ़ें
GENEVA, Sept. 18 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/035218) for “BONDED ASSEMBLIES INCLUDING THROUGH-DIE VIA STRUCTURES AND METHODS FOR FORMING THE SAME”. With publicatio... और पढ़ें